M-100 Tabletop Solder Reflow Production/Lab Oven
The RTC M-100 is a small compact conveyorized oven with a 4.5-inch wide belt that can reduce the time required to process parts using clean efficient infrared heat. Heat is uniform through the heating section. The infrared panel can be raised and lowered above the coveyor for inspection, maintenance or occasional retrieval of parts.
Solid state contols are employed for temperature and speed control. The M-100 has built-in line voltage regulation designed to keep heat output and conveyor speed constant despite fluxuations in line voltage. Designed for solder reflow applications and other precision low temperature drying and curing applications.
| Bake photo resist on silicon wafers | Cure offset printed marking inks |
| Cure epoxy potting compounds | Cure conformal coatings |
| Cure nomenclature and legend inks on printed circuit boards | Fuse components to pre-tinned or solder paste screen printed hybrid micro-circuits |
| Fuse plated tin-lead to confuctive areas on printed circuit boards | Reflow solder paste or solder preforms on integrated circuits |
| Cure bonding epoxies or encapsulating epoxies on integrated circuits | Dry thick film paste (to remove solvent fumes) on hybrid circuits prior to firing |
| Cure resist inks on printed circuit boards | Process heat shrink tubing |
Conveyor speed: 1.5 to 15 inches per minute
Heated Length: 1 zone, 23 inches
Max Design Temperature: 300C (572F)
Conveyor width: 4.5 inches
Product Gate Height: 1-3.5 inches adjustable
Voltage: 120 Vac, 2.7 kW, 1-ph 60 Hz, 23.3 A
Size: 48" L x 13.75 W" x 18.5" H (optional extensions may add to length)
Weight: 135 LB
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| Arrangement Drawing | |
